Printed electronics company Thin Film Electronics ASA has received a grant of EUR 472,312 (about $511,000) for over three years from the European Commission as part of its Horizon 2020 research and innovation initiative, which will ultimately support smart technology and data for global companies.
Previously: Smart Packaging and Optimizing Retail
The focus of TagItSmart will be to create a global-scale IoT platform – built using open-source architecture – to support trillions of smart products and the data they generate.
The grant will fund the “TagItSmart” project, through which Thinfilm will partner with global technology, consumer packaged goods, and smart-products companies to create the world’s first “Internet of Things” (IoT) platform featuring open-source, open API (Application Programming Interface) architecture.
Further reading: Smart Packaging for Smart Brands
Thinfilm will collaborate with several key partners on the TagItSmart project including Siemens; Unilever; IoT smart-products innovator, EVRYTHNG; Northern Europe’s largest multi-disciplinary research organization, VTT; and the University of Surrey.
“We’re pleased to be selected by the European Commission for participation in this exciting initiative,“ said Davor Sutija, CEO of Thinfilm. “The TagItSmart project aligns well with our mission of making trillions of everyday objects smart through the use of printed electronics, and we look forward to working closely with our project partners.”
The focus of TagItSmart will be to create a global-scale IoT platform – built using open-source architecture – to support trillions of smart products and the data they generate. Ultimately, TagItSmart will help organizations effectively address challenges regarding the management of IoT products and related services as they seek to capitalize on the growing “sensorization” of objects.
